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  1. "The 10th Inter-University Invitational Civil Engineering Competition" - A Team of Shinshu University won Excellent Architectural Design Award
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2018/07/13

"The 10th Inter-University Invitational Civil Engineering Competition" - A Team of Shinshu University won Excellent Architectural Design Award

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From the 26th of June 2018 to 30th, the 10th Inter-University Invitational Civil Engineering Competition was held at University of Macau, China. From Shinshu university, students of department of architecture, Sakakibara Takeaki, Goda Takanori, and Suzuki Ayano participated in this event under the supervision of prof. Yohei Endo. Shinshu University proudly announces that they won the Excellent Architectural Design Award!!

This competition aims to provide a platform for civil engineering students from Asia-pacific countries to express their creativity and skills, and to exchange ideas with their associates from different backgrounds. It is a biennial event. The first competition was held at Tsinghua University, Beijing in 2000. This is the first time for the Japanese universities to participate in this event.

For the 10th competition, 15 teams were invited from top-class universities including Tsinghua University, University of Hong Kong, the City University of Hong Kong, Hong Kong University of Science and Technology, Monash University and National University of Singapore.

The subject of the competition was the design of a curved bridge. Each team was required to fabricate a model within two and half days, using only the materials and equipment provided by the host university. The last day of the competition, the students made a multimedia presentation and conducted the test. Two tests were carried out. For the first test, a heavy steel plate was hung in the middle of the bridge deck while for the second one, a metal ball run through the road surface of the bridge. Each team was evaluated by the score obtained from the two tests, multi-media presentation and design excellence of the model. The next competition will be held at Harbin Institute of Technology, China in 2020.

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