工学部_研究紹介_2020_英語版
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Research of Solar Energy Utilization and Related MaterialsAssistant ProfessorB.E, EcE, Yangon Technological Univ.PhD (Engineering) Shinshu Univ.Research fields:・synthesis and application of ZnOnanostructures・transparent conductive oxides・solar energy excavationWe are exploring a new material that can be utilized in renewable energy devices.We are pursuing for developing a low pollution reaction process. Ultrasonic spray pyrolysis system developed in our Lab.Various structures of ZnO crystals prepared from our Lab.Iamnowexploringanewdevicethatcanbeexcavatedrenewablesolarenergyefficiently.Andalsofocusingontheresearchofutilizingconcentratedsolarenergyformaterialsynthesisprocesses.Tocontributetotheglobalsocietybymeansofinnovatingrenewableenergydevices(RED)andenvironment-friendlymaterials(EFM).TopromotetheapplicationsofREDandEFMinvariousindustrialfieldsinordertoreducetheenvironmentalpollution.ToestablishgreenelectronicproductionprocessbasedonlowpollutiontechnologiesGraduatestudentswillgetchangestobecomeactivescientistsorengineersofthefuturebyexperiencingadvancedresearchesinthefieldofenvironmental-friendlyelectronicatourLab.MyoThan HtayIn the FutureAfter GraduationElectrical& Computer EngineeringCommercial CAD tools for integrated circuit design are provided for academic usage. Photographs of the designed integrated circuit chip on the evaluation board (left). A measurement setup (right).KousukeMiyajiIn the FutureAfter GraduationElectrical& ComputerEngineeringAssociate Professor (2015-)He received Ph.Dfrom Univ. of Tokyo at 2008. He joined Shinshu Univ. from 2013. Research field: digital/ analog integrated circuit design and CMOS device physics for efficient power management systemsIntegrated Power ManagementCircuitDesignHighlyefficientandlowcostpowermanagementcircuitsincludingDC-DCswitchingregulators,AC-DCconvertersaremandatoryelementsinelectronicdevices.Whilethesecircuitsarewellestablished,westillconfrontwithmanychallengesandrequirementsasanewapplicationemerges,suchasenergyharvestersforsensornetworks,fastloadtrackersformulti-coreCPUsindatacenters,andwirelesspowertransmissionformedicalimplantapplications.Weapproachtotheseproblemsthroughmixedsignalintegratedcircuitdesignandnewpackagingtechnologiesincluding3-Dintegrations.Inthenearfuture,manyservicestoimproveourQoLwillbeprovidedbyacquiringbigdatafromlargesensornetworksandanalyzingthemathugedatacenters.Ourresearchwillcontributetorealizingbattery-lesssensorsthatoperateforalongtermandagreendatacenter,wherecurrentdatacenterconsumespowerasmuchasanuclearpowerplant.Applicationstominimallyinvasivemedicalimplantdevicesarealsoexpected.Integratedcircuitisoneofthemostgeneralandbasictechnologies.Acquiringskillsofintegratedcircuitdesignwillhelpgettingjobsinmostoftheindustriesinengineeringaswellastraditionalelectric/electronicmanufacturers.Infact,someautomotive,railwayandmedicalcompaniesrecruitcircuitdesignersastheirsystemsareusingsomanyintegratedcircuitsLayoutChip photo37

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