工学部_研究紹介_2019_英語版

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Colloidalmaterialsandtheirorganizationonsubstratearestronglyrequiredforrecentdevicefabricationbecauseofthedeviceminiaturization.Furthermore,theimprovementofdeviceperformanceisrequiredfortheconvenienceofourdailylife.TheSakai’sresearchgroupattemptstodevelop“high-puritycolloidalmaterials”becausetheyareexpectedtoexhibithigherperformance.Sakai LabSakai’sresearchaimstodevelopthemethodologiesforfabricationofthecolloidalmaterials(e.g.,metalnanoparticles,porousmaterials,emulsions,bubblesandfoam)andorganizationcolloidalmaterialsintomulti-dimensional(1D,2Dand3D)structuresinsolutionsand/oratinterfacesinanefficientmannerwithrespecttocost,energyandenvironment.Inparticular,amphiphiliccharacters(dualnatures)ofmoleculesorpolymersareessentialelementsfordesigningthemethodologies.ToshioSakaiAssociate ProfessorGenesis Research Institute, Inc., The State University of New York, Tokyo University of Science and ShinshuUniversity.Colloid and Interface Science.Preparation and characterization of colloidal materials such as metal nanoparticles, porous materials, emulsions, bubbles and foam.Colloid and Interface Sciencefor Beauty and HealthOptical micrograph of oil-in-water (O/W) emulsion..Emulsions are used in various fields such as cosmetic, food and medical field.Technologicalprocessessuchaspapermaking,potterymakingandthefabricationofsoaps,cosmeticsandmedicinesinvolvemanipulationofcolloidalsystems.Colloidandinterfacescienceprovidesvariousopportunitiesintheindustriessuchascatalyst,electronics,toiletryandmedicalfields.O/WIn the FutureAfter GraduationMaterialsChemistryMass Production of Micro Parts by ElectroplatingShinohara LabWearedoingresearchworkonpreparingthinalloyplates.Thealloyplateshavepropertiessuchaslowmeltingpoints,highcorrosionresistance,andhighhardness.Thethinalloyplateshavebeenpreparedbyplacingthepositivedepositionpotentialsofmetalsnearthenegativeonesofothermetalsusingorganicadditives.However,theseadditiveshavenegativeeffectsonthecharacteristicsofalloymetalplates.Inourlaboratory,wetrytomakealloyplatesbyapotentialpluselectroplatingmethodwithoutadditives.Usuallysmallpartsaremadebycuttingorshavingmaterials.Butthesemethodsarenotsuitableformassproductionofsmallpartswhosesizearesmallerthan0.1mm.So,wetrytomakesmallpartsbypilinguptheatomsusingelectroplatingmethods.Now,weareselectingproperalloysforthismethod.NaoyukiShinoharaAssociateProfessorAfter graduated the ShinshuUniv., I have been studingthe effects of organic sub-stances on the electroplating of metal.Cross section Cu/In deposit, Cu deposited on red area, Cu and In codepositedon green area.Cross section of Cu/In deposit prepared by potential pulse electrodepositionmethod.Thegraduatesofourlaboratoryareemployedinavarietyofmanufacturingcompaniesinthefieldsofelectronicsandprecisionequipments.In the FutureAfter GraduationMaterialsChemistry13